TIP 40 Series Thermal Interface Pad

Material Features Thermally Conductive, Unreinforced Gap Filling Material

As low as $283.2/m at 0% APR With paypal_credit

Describe： TSP 3.5~5.0 W/m∙K soft gap pad are ultra soft thermal interface gap fillers with great thermal performance and high compliance. The material yields extremely soft characteristics while maintaining elasticity and conformability. The Inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. It is ideal for use to fill gaps between high-power, heat-generating components and related heat sinks, boards or chassis.

Thermal conductivity 2.0~3.0 W/m·K
"Low “S-Class” thermal resistance at very low pressures"
Highly conformable, low hardness
Designed for low-stress applications
"Fiberglass reinforced for puncture, shear and tear resistance"

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TYPICAL APPLICATIONS

· Consumer electronics

· Power Supplies & Semiconductors

· Memory & Power Modules

· Microprocessors / Graphics Processors

· Telecommunications

AVAILABLE OPTIONS

· Standard sheet size: 18"x18" or 18"x9"

· 1-side / 2-side adhesive lamination

· Available in sheet / roll or precut finished parts

· PI fim / fiberglass carriers are optional

PROPERTIES	UNITS	TSP4550	TSP4525	TSP4525PM
Color	-
Thickness	mm	0.25~10	0.25~10	0.25~10
Thermal Conductivity	W/m·K	4.5	4.5	4.5
Thermal Resistance @1mm,20psi	°C·in2/W	0.39	0.35	0.45
Thermal Resistance @1mm,20psi	°C·cm2/W	2.51	2.26	2.9
Hardness	Shore OO	50	25	25
Flame Rating	-	V0	V0	V0
Dielectric Strength	kV(@1mm)	>10.0	>10.0	>15.0
Volume Resistivity	Ω·cm	≥1.0×1013	≥1.0×1013	≥1.0×1013
Density	g/cm3	3.1	3.1	3.1
Tensile Strength	psi	35	26	/
Elongation	%	42	45	/
Compression Deflection (%) at given pressure	10 psi	13	16	14
	50 psi	36	48	45
	100 psi	52	62	58
Dielectric Constant	@1MHz	5.5	5.5	5.5
TML（CVCM）	%	≤0.20(0.05)	≤0.20(0.05)	≤0.20(0.05)
Service Temp.	℃	-60~200	-60~200	-60~200
RoHS/REACH	-	compliance	compliance	compliance