A thermal pad is also called a thermal interface pad. It is a soft material that facilitates heat transfer between electronic components and heat sinks. It fills the microscopic gaps and irregularities between the two surfaces and ensures optimal thermal conductivity.
With the rapid development of the electronics industry,Guest Posting high thermal conductivity silicone film has brought great help to the industry. As the height integration and functional requirements of product chips increase, there is a growing demand for smaller sizes.
Thermal Gap Filler Pads are high heat transfer media which conform to surface irregularities and adhere to a wide range of shapes and sizes of components; in particular, recessed areas and protrusions.
A thermal pad is a type of interface material used to fill the gap between a heat source, such as a CPU or GPU, and a heatsink. Its main function is to facilitate the transfer of heat from the heat source into the heatsink.