TSP 5000 Series Thermal Soft Pad

Regular price Material Features High Performance,Thermally Conductive Gap Filling Material
Describe: This flexible series is an electrically insulating thermally conductive high performance silicone gap filler. It is ideal for use in applications where a very good thermal transfer over large gaps caused e.g. by big tole_x005frances or different stack up heights must be achieved. Due to the specific formulation and filling with ceramic particles the silicone elastomer has an extremely high thermal conductivity. Through its softness and flexibility the material perfectly mates to irregular surfaces thus filling gaps at low pressure. By its use the total thermal resistance is minimized. The natural tackiness of the material allows for an easy and reliable pre-assembly.
  • Thermal conductivity 2.0~3.0 W/m·K
  • "Low “S-Class” thermal resistance at very low pressures"
  • Highly conformable, low hardness
  • Designed for low-stress applications
  • "Fiberglass reinforced for puncture, shear and tear resistance"

Thermal ConductivityW/m·K5555
Thermal Resistance
HardnessShore OO45(1)555025
Flame Rating-V0V0V0V0
Dielectric StrengthkV(@1mm)>9.0>9.0>9.0>9.0
Volume ResistivityΩ·cm≥1.0×1013≥1.0×1013≥1.0×1013≥1.0×1013
Tensile Strengthpsi45525252
Compression Deflection (%) 
at given pressure
10 psi13121215
50 psi35323238
100 psi55505060
Dielectric Constant@1MHz66.566.5
Service Temp.-60~200-60~200-60~200-60~200

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